Adjustable selectivity slurry in CMP applications .

摘要

This invention at least more and offers the production method of the chemical machine grinding composition in order it grinds to process the baseplate which possesses second layer. The fact that both of the second chemical machine grinding composition which includes the abrasive which possesses the selectivity to which as for the said method the first chemical machine grinding composition which includes the abrasive which possesses the selectivity for more by comparison with second layer, and the second chemical machine grinding composition confronts more by comparison with the second layer which is stabilized under existing of the first chemical machine grinding composition and differs are offered is included, the fact that the first and second chemical machine grinding composition is mixed at the ratio which achieves the final selectivity for more and by comparison with second layer is included. This invention furthermore the baseplate offers the method where chemistry mechanically it grinds processes.