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Taping unit , electronic component accommodating way , and electronic component inspection equipment

机译:编带装置,电子零件收纳方式及电子零件检查装置

摘要

It provides a taping unit to be removed to efficiently detect the defective electronic components. In taping unit 1 in the longitudinal direction and accommodating an electronic component D in the carrier tape T which is arranged a plurality of accommodating portions U for transferring the upper feed path and electronic components in the housing portion U in the first position on the transport path 12 P1 There are accommodated, it is transported in transport means 10. The electronic component D which is transported in the transport direction downstream side of the second position P2 than the first position, the imaging means 20 for imaging. From the imaging result, failure detection means 30 detects a failure of the electronic component D. electronic components D a defect is detected, is removed from the housing portion U by the removal means 40. By a moving mechanism 50, the removal means 40 can be moved relative to the carrier tape T, is located at the second position P2.
机译:它提供了一个带子单元,可以将其拆下以有效地检测出有缺陷的电子组件。在带材单元1中沿纵向方向将电子元件D容纳在载带T中,载带T中布置有多个容纳部分U,用于在输送路径上的第一位置中将上馈送路径和电子元件转移到容纳部分U中12P1被收容并在输送单元10中输送。在比第一位置靠第二位置P2的输送方向下游侧输送的电子部件D中,摄像用摄像单元20。根据成像结果,故障检测装置30检测电子部件D的故障。通过移除装置40将检测到缺陷的电子部件D从壳体部分U中移除。通过移动机构50,移除装置40能够相对于载带T移动的“第二移动”位于第二位置P2。

著录项

  • 公开/公告号JP5633950B2

    专利类型

  • 公开/公告日2014-12-03

    原文格式PDF

  • 申请/专利权人 上野精機株式会社;

    申请/专利号JP20130547987

  • 发明设计人 宮田 正人;

    申请日2011-12-06

  • 分类号B65B15/04;B65B57/10;B65B57/00;

  • 国家 JP

  • 入库时间 2022-08-21 15:27:46

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