A method of producing a polyimide resin that produces a polyimide resin having excellent heat resistance and mechanical properties, and having a low dielectric constant even when heat-treated at a lower temperature. The method includes heating at 120° C. to 350° C. a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent including at least a compound represented by the general formula (1), in which R1 represents a hydrogen atom or a hydroxyl group, R2 and R3 independently represent a hydrogen atom or a C1 to C3 alkyl group, and R4 and R5 independently represent a C1 to C3 alkyl group.; 展开▼