METHOD OF FABRICATING A BATH OF ELECTROLYTE FOR PLATING A PLATINUM-BASED METALLIC UNDERLAYER ON A METALLIC SUBSTRATE

摘要

The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, the method comprising the following steps:a) providing a first system having ligands and amine functional groups, said first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X—(NH₂)_n, where X belongs to the group constituted by (CH₃, CH₃—CH₂, CH₃—(CH₂)_m), or NH₃ or an x^p−(NH₄)⁺_p salt where x is an acid radical belonging to the group constituted by (PO₄³⁻, HPO₄²⁻, H₂PO₄⁻, HPO₄²⁻and H₂PO₄⁻, SO₄²⁻, HSO₄⁻, H₂SO₄, HSO₄⁻, and H₂SO₄, CH₃COO⁻, CH₃COOH, and CH₃COO⁻), or H₂SO₄, or CH₃COOH, and where n, m, and p are non-zero integers;b) providing a second system forming a buffer system;c) providing a third system providing a metallic salt, and constituted by an aqueous solution of platinum;d) providing a fourth system suitable for imparting the conduction property to the medium; ande) mixing together the four systems so as to obtain the said electrolyte bath.;The method is applicable to plating a metallic underlayer as a thermal barrier on a part made of superalloy.