首页> 外国专利> METHOD OF PRODUCING TWO OR MORE THIN-FILM-BASED INTERCONNECTED PHOTOVOLTAIC CELLS

METHOD OF PRODUCING TWO OR MORE THIN-FILM-BASED INTERCONNECTED PHOTOVOLTAIC CELLS

机译:生产两个或多个基于薄膜的互连光伏电池的方法

摘要

The present invention is premised upon a method of producing two or more thin-film-based interconnected photovoltaic cells comprising the steps of: a) providing a photovoltaic article comprising: a flexible conductive substrate, at least on photo-electrically active layer, a top transparent conducting layer, and a carrier structure disposed above the tap transparent layer; b) forming one or more first channels through the layers of the photovoltaic article; c) applying an insulating layer to the conductive substrate and spanning the one or more first channel; d) removing the carrier structure; e) forming an addition to the one or more first channels through the insulating layer; f) forming one or more second channels off set from the one or mom first channels through the insulating layer to expose a conductive surface of the flexible conductive substrate; g) applying a first electrically conductive material to the conductive surface of the flexible conductive substrate via the one or more; second channels; h) applying an electrically conductive film to the first insulating layer, wherein the film is hi electrical communication with the flexible conductive substrate via the first electrically conductive material; J) applying a second electrically conductive material above the top transparent conducting layer and through the one or more first channels, electrically connecting the layers of the photovoltaic article from step b to the electrically conductive
机译:本发明以生产两个或多个基于薄膜的互连光伏电池的方法为前提,该方法包括以下步骤:a)提供光伏制品,该光伏制品包括:至少在光电活性层上,顶部上的柔性导电基底。透明导电层,以及设置在抽头透明层上方的载体结构; b)形成穿过光伏制品的层的一个或多个第一通道; c)在导电衬底上施加绝缘层并跨越一个或多个第一通道; d)去除载体结构; e)通过绝缘层形成对一个或多个第一通道的附加; f)通过绝缘层形成与一个或多个第一通道偏移的一个或多个第二通道,以暴露柔性导电基板的导电表面; g)通过一个或多个将第一导电材料施加到柔性导电基板的导电表面上;第二渠道; h)将导电膜施加到第一绝缘层上,其中该膜经由第一导电材料与柔性导电基板电连通; J)在顶部透明导电层上方并通过一个或多个第一通道施加第二导电材料,将步骤b中的光伏制品的各层电连接至导电体

著录项

  • 公开/公告号US2014360554A1

    专利类型

  • 公开/公告日2014-12-11

    原文格式PDF

  • 申请/专利权人 DOW GLOBAL TECHNOLOGIES LLC;

    申请/专利号US201214366160

  • 发明设计人 REBEKAH K. FEIST;MICHAEL E. MILLS;

    申请日2012-12-11

  • 分类号H01L25/04;

  • 国家 US

  • 入库时间 2022-08-21 15:25:36

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号