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METHOD OF STACKING A PLURALITY OF DIES TO FORM A STACKED SEMICONDUCTOR DEVICE, AND STACKED SEMICONDUCTOR DEVICE
METHOD OF STACKING A PLURALITY OF DIES TO FORM A STACKED SEMICONDUCTOR DEVICE, AND STACKED SEMICONDUCTOR DEVICE
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机译:堆叠多个裸片以形成堆叠的半导体器件的方法以及堆叠的半导体器件
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摘要
A method of stacking a plurality of first dies to a respective plurality of second dies, each one of the first dies having a surface including a surface coupling region which is substantially flat, each one of the second dies having a respective surface including a respective surface coupling region which is substantially flat, the method comprising the steps of: forming, by means of a screen printing technique, an adhesive layer on the first dies at the respective surface coupling regions; and arranging the surface coupling region of each second die in direct physical contact with a respective adhesive layer of a respective first die among said plurality of first dies.
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