A silicon carbide substrate, a silicon carbide ingot, and methods for manufacturing the silicon carbide substrate and the silicon carbide ingot capable of improving a yield of a semiconductor device having silicon carbide as constituent material are provided. In the silicon carbide substrate, patterns formed by crossing straight lines extending along the 11-20 direction and being observable by means of an X-ray topography are present at a number density of less than or equal to 0.1 patterns/cm2 on one main surface. As described above, in the silicon carbide substrate, the number density of the crossing patterns present on the main surface is reduced to less than or equal to 0.1 patterns/cm2. Therefore, when the semiconductor device is manufactured with use of a silicon carbide substrate, a lowering of a yield caused by the crossing patterns can be suppressed.
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机译:提供了一种碳化硅衬底,碳化硅锭以及用于制造能够提高以碳化硅作为构成材料的半导体器件的成品率的碳化硅衬底和碳化硅锭的方法。在碳化硅衬底中,以小于或等于0.1个图案/ cm 方向延伸的直线交叉并且通过X射线形貌可观察到的图案。 > 2 Sup>在一个主表面上。如上所述,在碳化硅衬底中,存在于主表面上的交叉图案的数量密度减小到小于或等于0.1个图案/ cm 2 Sup>。因此,当使用碳化硅衬底制造半导体器件时,可以抑制由交叉图案引起的成品率的降低。
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