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Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
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机译:使用混合激光划片和等离子蚀刻方法对聚合物干膜进行真空层压,以进行晶圆切割
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摘要
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves laminating a polymeric mask layer onto a front side of the semiconductor wafer by dry film vacuum lamination, the polymeric mask layer covering and protecting the integrated circuits. The method also involves patterning the polymeric mask layer with a laser scribing process to provide gaps in the polymeric mask layer, the gaps exposing regions of the semiconductor wafer between the integrated circuits. The method also involves plasma etching the semiconductor wafer through the gaps in the polymeric mask layer to singulate the integrated circuits. The method also involves, subsequent to plasma etching the semiconductor wafer, removing the polymeric mask layer.
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