首页> 外国专利> Phase-change memory devices including thermally-isolated phase-change layers and methods of fabricating the same

Phase-change memory devices including thermally-isolated phase-change layers and methods of fabricating the same

机译:包括热绝缘相变层的相变存储器件及其制造方法

摘要

Provided are a phase-change memory device and a method of fabricating the same. The device may include memory cells provided at intersections of word lines and bit lines that extend along first and second directions crossing each other, and a mold layer including thermal insulating regions, such as air gaps, that may be provided between the memory cells to separate the memory cells from each other. Each of the memory cells may include a lower electrode electrically connected to the word line to have a first width in the first direction, an upper electrode electrically connected to the bit line to have a second width greater than the first width in the first direction, and a phase-change layer provided between the lower and upper electrodes to have the first width in the first direction.
机译:提供一种相变存储器件及其制造方法。所述装置可包括:存储单元,其设置在沿彼此交叉的第一方向和第二方向延伸的字线和位线的交点处;以及模制层,其包括诸如气隙的隔热区域,所述模制层可设置在所述存储单元之间以分离。存储单元彼此之间。每个存储单元可以包括电连接到字线以在第一方向上具有第一宽度的下电极,电连接到位线以具有在第一方向上大于第一宽度的第二宽度的上电极,相变层设置在下部电极和上部电极之间以在第一方向上具有第一宽度。

著录项

  • 公开/公告号US9029828B2

    专利类型

  • 公开/公告日2015-05-12

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号US201314067228

  • 发明设计人 GYUHWAN OH;

    申请日2013-10-30

  • 分类号H01L45/00;H01L27/24;

  • 国家 US

  • 入库时间 2022-08-21 15:21:44

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