首页> 外国专利> METHOD OF FORMING A PHASE-CHANGE MEMORY UNIT AND METHOD OF MANUFACTURING A PHASE-CHANGE MEMORY DEVICE INCLUDING THE PHASE-CHANGE MATERIAL LAYER

METHOD OF FORMING A PHASE-CHANGE MEMORY UNIT AND METHOD OF MANUFACTURING A PHASE-CHANGE MEMORY DEVICE INCLUDING THE PHASE-CHANGE MATERIAL LAYER

机译:形成相变存储器单元的方法和制造包括相变材料层的相变存储器的方法

摘要

A method for forming a phase change memory unit and a method for manufacturing a phase change memory device including a phase-change material layer are provided to reduce a set resistance and operational current and to enhance durability and a sensing margin. A contact region(105) is formed on a substrate(100). A lower electrode(140) is electrically connected to the contact region. A preliminary phase change material layer is formed on the lower electrode by using a carbon-doped chalcogenide compound or a carbon or nitrogen-doped chalcogenide compound on a lower electrode. A phase change material layer is formed by doping a stabilization metal onto the preliminary phase change material layer. An upper electrode(175) is formed on the phase change material layer. An insulating structure having at least one pad connected to the contact region is formed on the substrate before the lower electrode is formed.
机译:提供一种用于形成相变存储单元的方法和一种用于制造包括相变材料层的相变存储器件的方法,以减小设定电阻和工作电流,并提高耐用性和感测裕度。接触区域(105)形成在基板(100)上。下电极(140)电连接到接触区域。通过在下部电极上使用碳掺杂硫族化物化合物或碳或氮掺杂硫族化物化合物在下部电极上形成预相变材料层。通过将稳定化金属掺杂到初步相变材料层上来形成相变材料层。在相变材料层上形成上部电极(175)。在形成下部电极之前,在基板上形成具有至少一个连接至接触区域的焊盘的绝缘结构。

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