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Metal oxide layer composition control by atomic layer deposition for thin film transistor

机译:通过原子层沉积控制薄膜晶体管的金属氧化物层组成

摘要

This disclosure provides systems, methods and apparatus for a thin film transistor (TFT) device on a substrate. In one aspect, the TFT device includes a gate electrode, an oxide semiconductor layer, and a gate insulator between the gate electrode and the oxide semiconductor layer. The oxide semiconductor layer includes at least two metal oxides, with the two metal oxides having a varying concentration relative to one another between a lower surface and an upper surface of the oxide semiconductor layer. The TFT device also includes a source metal adjacent to a portion of the oxide semiconductor layer and a drain metal adjacent to another portion of the oxide semiconductor layer. The composition of the oxide semiconductor layer can be precisely controlled by a sequential deposition technique using atomic layer deposition (ALD).
机译:本公开提供了用于基板上的薄膜晶体管(TFT)器件的系统,方法和装置。一方面,TFT器件包括栅电极,氧化物半导体层以及在栅电极和氧化物半导体层之间的栅绝缘体。氧化物半导体层包括至少两种金属氧化物,其中两种金属氧化物在氧化物半导体层的下表面和上表面之间具有相对于彼此的浓度变化。 TFT器件还包括与氧化物半导体层的一部分相邻的源极金属和与氧化物半导体层的另一部分相邻的漏极金属。可以通过使用原子层沉积(ALD)的顺序沉积技术来精确地控制氧化物半导体层的组成。

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