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METAL OXIDE LAYER COMPOSITION CONTROL BY ATOMIC LAYER DEPOSITION FOR THIN FILM TRANSISTOR

机译:薄膜晶体管的原子层沉积控制金属氧化物层组成

摘要

The present disclosure provides systems, methods, and apparatus for a thin film transistor (TFT) device on a substrate. In an aspect, the TFT device includes a gate electrode, an oxide semiconductor layer, and a gate insulator between the gate electrode and the oxide semiconductor layer. The oxide semiconductor layer includes at least two metal oxides, the two metal oxides having a concentration varying with respect to the other between the lower surface and the upper surface of the oxide semiconductor layer. The TFT device also includes a source metal adjacent to a portion of the oxide semiconductor layer and a drain metal adjacent to another portion of the oxide semiconductor layer. The composition of the oxide semiconductor layer can be precisely controlled by a sequential deposition technique using atomic layer deposition (ALD).
机译:本公开提供了用于基板上的薄膜晶体管(TFT)器件的系统,方法和装置。在一方面,TFT装置包括栅电极,氧化物半导体层以及在栅电极和氧化物半导体层之间的栅绝缘体。氧化物半导体层包括至少两种金属氧化物,这两种金属氧化物的浓度在氧化物半导体层的下表面和上表面之间相对于彼此变化。 TFT器件还包括与氧化物半导体层的一部分相邻的源极金属和与氧化物半导体层的另一部分相邻的漏极金属。可以通过使用原子层沉积(ALD)的顺序沉积技术来精确地控制氧化物半导体层的组成。

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