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Three dimensional branchline coupler using through silicon vias and design structures
Three dimensional branchline coupler using through silicon vias and design structures
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机译:使用硅通孔和设计结构的三维支线耦合器
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摘要
A three dimensional (3D) branchline coupler using through silicon vias (TSV), methods of manufacturing the same and design structures are disclosed. The method includes forming a first waveguide structure in a first dielectric material. The method further includes forming a second waveguide structure in a second dielectric material. The method further includes forming through silicon vias through a substrate formed between the first dielectric material and the second dielectric material, which connects the first waveguide structure to the second waveguide structure.
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