首页> 外国专利> Integrated circuit apparatus, three-dimensional integrated circuit, three-dimensional processor device, and process scheduler, with configuration taking account of heat

Integrated circuit apparatus, three-dimensional integrated circuit, three-dimensional processor device, and process scheduler, with configuration taking account of heat

机译:具有考虑热量的配置的集成电路装置,三维集成电路,三维处理器装置和处理调度器

摘要

The present invention provides a three-dimensional integrated circuit wherein generation of hot spot which makes a high temperature part as a result of intensively generated heat can be suppressed in. The integrated circuit apparatus comprises: a first circuit made of a memory circuit, a second circuit made of an arithmetic circuit, and a control circuit. The first circuit is partitioned into a plurality of circuit blocks according to the distance from the arranged position of the second circuit, and the control circuit controls the partitioned respective circuit blocks separately.
机译:本发明提供了一种三维集成电路,其中可以抑制由于大量产生的热量而导致高温部分的热点的产生。集成电路装置包括:第一电路,由存储电路构成;第二电路,由存储电路构成。由运算电路构成的电路和控制电路。根据距第二电路的布置位置的距离将第一电路划分为多个电路块,并且控制电路分别控制所划分的各个电路块。

著录项

  • 公开/公告号US9122286B2

    专利类型

  • 公开/公告日2015-09-01

    原文格式PDF

  • 申请/专利权人 PANASONIC CORPORATION;

    申请/专利号US201213996160

  • 发明设计人 KOUJI KAI;TAKASHI MORIMOTO;

    申请日2012-10-22

  • 分类号G11C7/04;G05F5/00;H01L25/065;G06F12/08;H01L27/02;H01L27/105;H01L27/11;G06F15/80;H01L23/34;H01L23/00;H01L25/18;

  • 国家 US

  • 入库时间 2022-08-21 15:19:45

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