首页> 外国专利> INTEGRATED CIRCUIT APPARATUS, THREE-DIMENSIONAL INTEGRATED CIRCUIT, THREE-DIMENSIONAL PROCESSOR DEVICE, AND PROCESS SCHEDULER, WITH CONFIGURATION TAKING ACCOUNT OF HEAT

INTEGRATED CIRCUIT APPARATUS, THREE-DIMENSIONAL INTEGRATED CIRCUIT, THREE-DIMENSIONAL PROCESSOR DEVICE, AND PROCESS SCHEDULER, WITH CONFIGURATION TAKING ACCOUNT OF HEAT

机译:集成电路装置,三维集成电路,三维处理器设备和过程调度器,其配置考虑了热量

摘要

The present invention provides a three-dimensional integrated circuit wherein generation of hot spot which makes a high temperature part as a result of intensively generated heat can be suppressed in. The integrated circuit apparatus comprises: a first circuit made of a memory circuit, a second circuit made of an arithmetic circuit, and a control circuit. The first circuit is partitioned into a plurality of circuit blocks according to the distance from the arranged position of the second circuit, and the control circuit controls the partitioned respective circuit blocks separately.
机译:本发明提供了一种三维集成电路,其中可以抑制由于大量产生的热量而导致高温部分的热点的产生。集成电路装置包括:第一电路,由存储电路构成;第二电路,由存储电路构成。由运算电路构成的电路和控制电路。根据距第二电路的布置位置的距离将第一电路划分为多个电路块,并且控制电路分别控制所划分的各个电路块。

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