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INTEGRATED CIRCUIT APPARATUS, THREE-DIMENSIONAL INTEGRATED CIRCUIT, THREE-DIMENSIONAL PROCESSOR DEVICE, AND PROCESS SCHEDULER, WITH CONFIGURATION TAKING ACCOUNT OF HEAT
INTEGRATED CIRCUIT APPARATUS, THREE-DIMENSIONAL INTEGRATED CIRCUIT, THREE-DIMENSIONAL PROCESSOR DEVICE, AND PROCESS SCHEDULER, WITH CONFIGURATION TAKING ACCOUNT OF HEAT
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机译:集成电路装置,三维集成电路,三维处理器设备和过程调度器,其配置考虑了热量
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摘要
The present invention provides a three-dimensional integrated circuit wherein generation of hot spot which makes a high temperature part as a result of intensively generated heat can be suppressed in. The integrated circuit apparatus comprises: a first circuit made of a memory circuit, a second circuit made of an arithmetic circuit, and a control circuit. The first circuit is partitioned into a plurality of circuit blocks according to the distance from the arranged position of the second circuit, and the control circuit controls the partitioned respective circuit blocks separately.
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