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Method for producing a semiconductor body having a recombination zone, semiconductor component having a recombination zone, and method for producing such a semiconductor component

机译:具有复合区域的半导体本体的制造方法,具有复合区域的半导体部件以及该半导体部件的制造方法

摘要

In a method for producing a semiconductor body, impurities which act as recombination centers in the semiconductor body and form a recombination zone are introduced into the semiconductor body during the process of producing the semiconductor body. In a semiconductor component, comprising a semiconductor body having a front surface and an opposite rear surface, and also a recombination zone formed by impurities between the front and rear surfaces, wherein the impurities act as recombination centers, the surface state density at the front and rear surfaces of the semiconductor body is just as high as the surface state density at a front and rear surface of an identical semiconductor body without a recombination zone.
机译:在制造半导体本体的方法中,在半导体本体的制造过程中,将充当半导体本体中的重组中心并形成重组区的杂质引入到半导体本体中。在半导体部件中,包括:具有前表面和相对的后表面的半导体本体,以及由前表面和后表面之间的杂质形成的复合区,其中杂质用作复合中心,在前表面和后表面的表面态密度高。半导体本体的后表面与没有复合区的相同半导体本体的前表面和后表面的表面状态密度一样高。

著录项

  • 公开/公告号US9012311B2

    专利类型

  • 公开/公告日2015-04-21

    原文格式PDF

  • 申请/专利权人 FRANK PFIRSCH;HANS-JOACHIM SCHULZE;

    申请/专利号US20080170470

  • 发明设计人 FRANK PFIRSCH;HANS-JOACHIM SCHULZE;

    申请日2008-07-10

  • 分类号H01L21/425;H01L29/167;H01L21/22;H01L21/265;H01L29/06;H01L29/08;H01L29/36;H01L29/66;H01L29/739;H01L29/78;H01L29/861;

  • 国家 US

  • 入库时间 2022-08-21 15:19:17

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