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Method of making wire bond vias and microelectronic package having wire bond vias
Method of making wire bond vias and microelectronic package having wire bond vias
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机译:引线键合通孔的制造方法以及具有引线键合通孔的微电子封装
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摘要
Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.
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