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Abrasive processing of hard and /or brittle materials

机译:硬和/或脆性材料的磨料加工

摘要

Abrasive articles possessing a highly open (porous) structure and uniform abrasive grit distribution are disclosed. The abrasive articles are fabricated using a metal matrix (e.g., fine nickel, tin, bronze and abrasives). The open structure is controlled with a porosity scheme, including interconnected porosity (e.g., formed by leaching of dispersoid), closed porosity (e.g., induced by adding a hollow micro-spheres and/or sacrificial pore-forming additives), and/or intrinsic porosity (e.g., controlled via matrix component selection to provide desired densification). In some cases, manufacturing process temperatures for achieving near full density of metal bond with fillers and abrasives, are below the melting point of the filler used, although sacrificial fillers may be used as well. The resulting abrasive articles are useful in high performance cutting and grinding operations, such as back-grinding silicon, alumina titanium carbide, and silicon carbide wafers to very fine surface finish values. Techniques of use and manufacture are also disclosed.
机译:公开了具有高度开放(多孔)结构和均匀的磨料粒度分布的磨料制品。使用金属基质(例如,细镍,锡,青铜和磨料)制造磨料物品。用孔隙率方案控制开放结构,包括互连孔隙率(例如,通过分散体的浸出形成),封闭孔隙率(例如,通过添加中空微球和/或牺牲孔形成添加剂引起的孔隙率)和/或固有孔隙率孔隙率(例如,通过基质成分的选择进行控制以提供所需的致密化)。在某些情况下,尽管也可以使用牺牲性填料,但用于实现与填料和磨料的金属结合几乎完全密度的制造过程温度低于所用填料的熔点。所得的磨料制品可用于高性能的切割和研磨操作,例如将硅,氧化铝碳化钛和碳化硅晶片背面研磨至非常精细的表面光洁度值。还公开了使用和制造的技术。

著录项

  • 公开/公告号US8894731B2

    专利类型

  • 公开/公告日2014-11-25

    原文格式PDF

  • 申请/专利权人 SRINIVASAN RAMANATH;PARUL WALIA;

    申请/专利号US20070906263

  • 发明设计人 SRINIVASAN RAMANATH;PARUL WALIA;

    申请日2007-10-01

  • 分类号B24B1/00;B24D3/00;

  • 国家 US

  • 入库时间 2022-08-21 15:17:56

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