A housing for supporting a light-emitting diode chip is disclosed. The housing includes a housing body made of non-fluoro-containing polymer and a surface coating layer covering at least a portion of the housing body. The surface coating layer is made of fluoropolymer dispersion and provided for reflecting light emitted from a light-emitting diode chip disposed on the housing body. A structure of light-emitting diode including the housing and a light-emitting diode chip is also disclosed.
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