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LED housing with fluoropolymer surface coating layer and LED structure having the same

机译:具有含氟聚合物表面涂层的LED壳体和具有该壳体的LED结构

摘要

A housing for supporting a light-emitting diode chip is disclosed. The housing includes a housing body made of non-fluoro-containing polymer and a surface coating layer covering at least a portion of the housing body. The surface coating layer is made of fluoropolymer dispersion and provided for reflecting light emitted from a light-emitting diode chip disposed on the housing body. A structure of light-emitting diode including the housing and a light-emitting diode chip is also disclosed.
机译:公开了一种用于支撑发光二极管芯片的壳体。壳体包括由非含氟聚合物制成的壳体和覆盖壳体的至少一部分的表面涂层。该表面涂层由含氟聚合物分散体制成,并设置成用于反射从设置在壳体上的发光二极管芯片发射的光。还公开了包括壳体和发光二极管芯片的发光二极管的结构。

著录项

  • 公开/公告号US9000463B2

    专利类型

  • 公开/公告日2015-04-07

    原文格式PDF

  • 申请/专利权人 PANG-MING HUANG;

    申请/专利号US201113086739

  • 发明设计人 PANG-MING HUANG;

    申请日2011-04-14

  • 分类号H01L33/48;H01L33/60;H01L33/50;H01L33/62;

  • 国家 US

  • 入库时间 2022-08-21 15:17:04

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