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MEMS sensor with stress isolation and method of fabrication

机译:具有应力隔离的MEMS传感器及其制造方法

摘要

A MEMS sensor (20, 86) includes a support structure (26) suspended above a surface (28) of a substrate (24) and connected to the substrate (24) via spring elements (30, 32, 34). A proof mass (36) is suspended above the substrate (24) and is connected to the support structure (26) via torsional elements (38). Electrodes (42, 44), spaced apart from the proof mass (36), are connected to the support structure (26) and are suspended above the substrate (24). Suspension of the electrodes (42, 44) and proof mass (36) above the surface (28) of the substrate (24) via the support structure (26) substantially physically isolates the elements from deformation of the underlying substrate (24). Additionally, connection via the spring elements (30, 32, 34) result in the MEMS sensor (22, 86) being less susceptible to movement of the support structure (26) due to this deformation.
机译:MEMS传感器( 20、86 )包括悬挂在基板()的表面( 28 )上方的支撑结构( 26 ) 24 )并通过弹簧元件( 30、32、34 )连接到基板( 24 )。检验质量( 36 )悬挂在基板( 24 )上方,并通过扭力元件( B> 26 )连接到支撑结构( 26 ) B> 38 )。与检测质量( 36 )间隔开的电极( 42、44 )连接到支撑结构( 26 )并悬空( 24 )上方。在基板( 24)的表面( 28 )上方悬挂电极( 42、44 )和检测质量( 36 )通过支撑结构( 26 )基本上将元素与下层基板( 24 )的变形隔离。另外,通过弹簧元件( 30、32、34 )的连接导致MEMS传感器( 22、86 )不太容易受到支撑结构( > 26 )。

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