首页> 外国专利> non-electrolytic substrate metallization process by in-line spraying with a preliminary surface treatment, and device for process implementation

non-electrolytic substrate metallization process by in-line spraying with a preliminary surface treatment, and device for process implementation

机译:通过在线喷涂进行初步表面处理的非电解基板金属化工艺及其工艺实现装置

摘要

A method of metallizing the surface of a substrate electrolessly, by spraying one or more oxidation-reduction solutions thereonto. The steps of this method include: a) physical or chemical treatment to reduce the surface tension of the substrate before metallization; b) electroless metallization of the surface of the substrate treated in step a), by spraying one or more oxidation-reduction solutions in the form of one or more aerosols thereonto; and c) formation of a top coat on the metallized surface. Compact devices for implementing this method and the products obtained are also disclosed.
机译:一种通过在其表面上喷涂一种或多种氧化还原溶液将其表面化学镀的方法。该方法的步骤包括:a)进行物理或化学处理以降低金属化之前衬底的表面张力; b)通过在其上喷涂一种或多种以一种或多种气溶胶形式的氧化还原溶液,对步骤a)中处理过的基材表面进行化学镀金属; c)在金属化表面上形成面涂层。还公开了用于实施该方法的紧凑装置和所获得的产品。

著录项

  • 公开/公告号BRPI0916730A2

    专利类型

  • 公开/公告日2015-11-10

    原文格式PDF

  • 申请/专利权人 JET METAL TECHNOLOGIES;

    申请/专利号BR2009PI16730

  • 发明设计人 SAMUEL STREMSDOERFER;

    申请日2009-07-30

  • 分类号C23C18/31;

  • 国家 BR

  • 入库时间 2022-08-21 15:15:56

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