首页>
外国专利>
DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING, METHOD FOR LOW-TEMPERATURE PRESSURE SINTERING AND POWER ELECTRONICS ASSEMBLY
DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING, METHOD FOR LOW-TEMPERATURE PRESSURE SINTERING AND POWER ELECTRONICS ASSEMBLY
展开▼
机译:低温烧结设备,低温烧结方法和功率电子组件
展开▼
页面导航
摘要
著录项
相似文献
摘要
The invention relates to a device for the low-temperature pressure sintering of electric components (8) on a substrate (6), said device having a heatable upper die (1, 2, 3) and a heatable lower die. The device is characterised in that the upper die (1, 2, 3) and the lower die each have at least one pressure pad (4).
展开▼