A METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE, AND THE USE OF A NON-CONTACT UPWARD JETTING SYSTEM IN THE FABRICATION OF A SEMICONDUCTOR PACKAGE

摘要

A method for fabricating a semiconductor package, comprising the steps of: a) providing a semiconductor chip having a bottom surface to which one or more solder contact points are attached; b) applying a curable epoxy composition upwards to at least one part of the bottom surface and/or to at least one of the solder contact points of the semiconductor chip by means of a non-contact jetting system; c) placing the coated semiconductor chip onto a circuit board or a carrier substrate; d) coupling the one or more solder contact points to the circuit board or the carrier substrate and curing the curable epoxy composition. The use of a non-contact upward jetting system in the fabrication of a semiconductor package is also disclosed.