首页>
外国专利>
TEMPORARY ADHERING MATERIAL FOR WAFER, FILM FOR TEMPORARY ADHERING AND WAFER PROCESSING LAMINATE USING THE SAME, AND MANUFACTURING METHOD OF THIN WAFER USING THE SAME
TEMPORARY ADHERING MATERIAL FOR WAFER, FILM FOR TEMPORARY ADHERING AND WAFER PROCESSING LAMINATE USING THE SAME, AND MANUFACTURING METHOD OF THIN WAFER USING THE SAME
展开▼
机译:晶圆的临时粘合材料,使用相同的晶圆临时粘合和晶圆加工层压的薄膜以及使用相同的薄晶圆的制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Provided in the present invention is a temporary adhering material which is characterized by including a first temporary adhering layer including a silicone containing polymer layer (A) containing a photo base generating agent; and a second temporary adhering layer including a silicone containing polymer layer (B) which is different from the polymer layer (A) and not containing the photo base generating agent laminated on the first temporary adhering layer. The temporary adhering layers of the present invention can form a temporary adhering layer having high uniformity of film thickness even for a wafer having bumps and can easily obtain a uniform thin wafer of 50 micrometers or less by the uniformity of film thickness. In addition, the wafer is separated in stress-free by the small amount of exposure, when separated from a support, in order to manufacture the thin wafer by easily treating the thin wafer without damage to the thin wafer which can be easily cracked.
展开▼