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Method for analyzing bulk metallic impurities in semiconductor wafer
Method for analyzing bulk metallic impurities in semiconductor wafer
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机译:半导体晶片中大量金属杂质的分析方法
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摘要
A method for analyzing metallic impurities in semiconductor substrate comprises the steps of: heating a semiconductor substrate; etching an upper part of the semiconductor substrate heated by a gas containing at least one of HF or HNO_3; collecting metallic ingredients in the etched upper part of the semiconductor substrate; and analyzing collected metallic ingredients.
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