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METHOD FOR GROWING VARIOUS KINDS OF SEMICONDUCTOR EPITAXIAL LAYERS ON SILICON (001) SUBSTRATE

机译:在硅(001)基体上生长各种半导体表皮层的方法

摘要

The present invention relates to a method for forming a semiconductor device with high quality on a silicon substrate and, more particularly, to a method for growing a semiconductor epitaxial layer on a silicon substrate. The method for growing the semiconductor epitaxial layer on the silicon substrate according to the embodiment of the present invention includes a first step of forming an aspect ratio trapping (ART) pattern by an insulation material, a second step of forming an arrow aspect ratio trapping (AART) pattern, a third step of forming an undercut on an interface of silicon and the insulation material, and a fourth step of growing the semiconductor layer on the upper sides of the AART pattern region and the ART pattern region.;COPYRIGHT KIPO 2015
机译:本发明涉及在硅衬底上高质量形成半导体器件的方法,更具体地说,涉及在硅衬底上生长半导体外延层的方法。根据本发明实施例的在硅衬底上生长半导体外延层的方法包括通过绝缘材料形成长宽比捕获(ART)图案的第一步骤,形成箭头长宽比捕获的第二步骤( AART)图案,在硅和绝缘材料的界面上形成底切的第三步,以及在AART图案区域和ART图案区域的上侧生长半导体层的第四步骤。; COPYRIGHT KIPO 2015

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