首页> 外国专利> METAL-FOIL-ATTACHED ADHESIVE SHEET, METAL-FOIL-ATTACHED LAMINATED BOARD, METAL-FOIL-ATTACHED MULTI-LAYER BOARD, AND METHOD OF MANUFACTURING CIRCUIT BOARD

METAL-FOIL-ATTACHED ADHESIVE SHEET, METAL-FOIL-ATTACHED LAMINATED BOARD, METAL-FOIL-ATTACHED MULTI-LAYER BOARD, AND METHOD OF MANUFACTURING CIRCUIT BOARD

机译:金属箔粘合板,金属箔层压板,金属箔多层板以及制造电路板的方法

摘要

A metal-foil-attached adhesive sheet comprises: a metal foil, an exfoliation layer prepared on the metal foil, and an adhesive layer formed with a thermosetting resin composition in a semi hardening state. When a filling strength in an interface between the metal foil and the exfoliation layer is P1, and a filling strength in an interface between the exfoliation layer and the hardened adhesion layer is P2; P1 is greater than P2 (P1P2).;COPYRIGHT KIPO 2016
机译:附有金属箔的粘合片包括:金属箔;在该金属箔上制备的剥离层;以及由半固化状态的热固性树脂组合物形成的粘合层。金属箔与剥离层之间的界面的填充强度为P1,剥离层与硬化粘接层之间的界面的填充强度为P2。 P1大于P2(P1> P2).; COPYRIGHT KIPO 2016

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号