首页> 外国专利> METAL-FOIL-ATTACHED ADHESIVE SHEET, METAL-FOIL-ATTACHED LAMINATED BOARD, METAL-FOIL-ATTACHED MULTI-LAYER BOARD, AND METHOD OF MANUFACTURING CIRCUIT BOARD

METAL-FOIL-ATTACHED ADHESIVE SHEET, METAL-FOIL-ATTACHED LAMINATED BOARD, METAL-FOIL-ATTACHED MULTI-LAYER BOARD, AND METHOD OF MANUFACTURING CIRCUIT BOARD

机译：金属箔粘合板，金属箔层压板，金属箔多层板以及制造电路板的方法

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摘要

A metal-foil-attached adhesive sheet includes a metal foil, a release layer provided on the metal foil, and an adhesive layer provided on the release layer and made of a thermosetting resin composition which is semi-cured. A peeling strength P1 at an interface between the metal foil and the release layer and a peeling strength P2 at an interface between the release layer and the adhesive layer after curing satisfy P1P2.

机译：附有金属箔的粘合片包括金属箔，设置在该金属箔上的脱模层，以及设置在该脱模层上并由半固化的热固性树脂组合物制成的粘合层。固化后，金属箔与剥离层之间的界面的剥离强度P 1 和剥离层与粘接剂层之间的界面的剥离强度P 2 P 1 2。 展开▼

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公开/公告号US2015296632A1

专利类型

公开/公告日2015-10-15

原文格式PDF

申请/专利权人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD.;
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申请/专利号US201514674930

发明设计人 KENTARO FUJINO;NORIKO ONUMA;RIHOKO TOMBE;
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申请日2015-03-31

分类号H05K3/46;H05K1/09;

国家 US

入库时间 2022-08-21 15:27:24

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1. 覆金属箔层压板及其制造方法、附着树脂的金属箔、和印刷电路板 [P] . 中国专利： CN106660322B . 2019.11.22

2. 覆金属箔层压板及其制造方法、附着树脂的金属箔、和印刷电路板 [P] . 中国专利： CN106660322A . 2017-05-10

3. METAL-FOIL-ATTACHED ADHESIVE SHEET, METAL-FOIL-ATTACHED LAMINATED BOARD, METAL-FOIL-ATTACHED MULTI-LAYER BOARD, AND METHOD OF MANUFACTURING CIRCUIT BOARD [P] . 韩国专利： KR101560121B1 . 2015-10-13

机译：金属箔粘合板，金属箔层压板，金属箔多层板以及制造电路板的方法

4. ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE MATERIAL, ADHESIVE LAYER, ADHESIVE SHEET, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, FLEXIBLE COPPER-CLAD LAMINATE, PRINTED CIRCUIT BOARD, FLEXIBLE PRINTED CIRCUIT BOARD, MULTILAYER WIRING BOARD, PRINTED CIRCUIT BOARD, AND FLEXIBLE PRINTED CIRCUIT BOARD [P] . 日本专利： JP2016194055A . 2016-11-17

机译：胶粘剂成分，薄膜状胶粘剂，胶粘剂层，胶粘剂铜箔，树脂覆铜箔，覆铜箔层压板，柔性覆铜箔板，印刷电路板，柔性印制线路板和柔性印刷线路板，印刷电路板

5. Adhesive composition, adhesive film, adhesive layer, adhesive sheet, resin-coated copper foil, copper-clad laminate, flexible copper-clad laminate, printed wiring board, flexible printed wiring board, multilayer wiring board, printed circuit board, and Flexible printed circuit board [P] . 日本专利： JP6593649B2 . 2019-10-23

机译：粘合剂组合物，粘合剂膜，粘合剂层，粘合剂片，树脂涂覆的铜箔，覆铜层压板，挠性覆铜层压板，印刷线路板，挠性印刷线路板，多层线路板，印刷电路板和挠性印刷电路板

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