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A method of manufacturing semiconductor devices comprising generating and annealing of radiation-induced crystal defects
A method of manufacturing semiconductor devices comprising generating and annealing of radiation-induced crystal defects
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机译:一种制造半导体器件的方法,包括产生和退火辐射诱发的晶体缺陷
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摘要
The production of auxiliary crystal defects (212), in a semiconductor substrate (500) is induced. Then, the semiconductor substrate (500) at a temperature above a dissociation temperature of advance cured, in which the auxiliary crystal defects (212) in the defect complex (219) are transformed, which can be electrically inactive. Then, protons in the semiconductor substrate (500) are implanted, the production of radiation-induced main crystal defects (222) to induce. The defect complex (219), the effectiveness of the formation of particles correlated dopants due to the radiation-induced main crystal defects (222) increase.
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