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A method of manufacturing semiconductor devices comprising generating and annealing of radiation-induced crystal defects

机译:一种制造半导体器件的方法,包括产生和退火辐射诱发的晶体缺陷

摘要

The production of auxiliary crystal defects (212), in a semiconductor substrate (500) is induced. Then, the semiconductor substrate (500) at a temperature above a dissociation temperature of advance cured, in which the auxiliary crystal defects (212) in the defect complex (219) are transformed, which can be electrically inactive. Then, protons in the semiconductor substrate (500) are implanted, the production of radiation-induced main crystal defects (222) to induce. The defect complex (219), the effectiveness of the formation of particles correlated dopants due to the radiation-induced main crystal defects (222) increase.
机译:诱导在半导体衬底(500)中产生辅助晶体缺陷(212)。然后,在高于预先固化的解离温度的温度下的半导体衬底(500)中,缺陷复合体(219)中的辅助晶体缺陷(212)被转变,这可以是电惰性的。然后,在半导体衬底(500)中注入质子,以产生辐射诱导的主晶体缺陷(222)。缺陷复合物(219),由于辐射诱导的主晶体缺陷(222)导致的形成与颗粒相关的掺杂剂的有效性增加。

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