首页> 外国专利> Transistor Architecture having extended recessed spacer and source/drain regions and method of making same

Transistor Architecture having extended recessed spacer and source/drain regions and method of making same

机译:具有延伸的凹陷间隔物和源极/漏极区域的晶体管架构及其制造方法

摘要

Techniques are disclosed for forming transistor architectures having extended recessed spacer and source/drain (S/D) regions. In some embodiments, a recess can be formed, for example, in the top of a fin of a fin-based field-effect transistor (finFET), such that the recess allows for forming extended recessed spacers and S/D regions in the finFET that are adjacent to the gate stack. In some instances, this configuration provides a higher resistance path in the top of the fin, which can reduce gate-induced drain leakage (GIDL) in the finFET. In some embodiments, precise tuning of the onset of GIDL can be provided. Some embodiments may provide a reduction in junction leakage (Lb) and a simultaneous increase in threshold voltage (VT). The disclosed techniques can be implemented with planar and non-planar fin-based architectures and can be used in standard metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) process flows, in some embodiments.
机译:公开了用于形成具有延伸的凹陷间隔物和源极/漏极(S / D)区域的晶体管架构的技术。在一些实施例中,可以在例如基于鳍的场效应晶体管(finFET)的鳍的顶部中形成凹部,使得该凹部允许在finFET中形成延伸的凹间隔物和S / D区域。与栅极叠层相邻的那些。在某些情况下,此配置在鳍片的顶部提供了更高的电阻路径,这可以减少finFET中的栅极感应漏极泄漏(GIDL)。在一些实施例中,可以提供GIDL的发作的精确调整。一些实施例可以提供结泄漏(Lb)的减少和阈值电压(VT)的同时增加。在一些实施例中,所公开的技术可以利用基于平面和非平面鳍的架构来实现,并且可以在标准金属氧化物半导体(MOS)和互补MOS(CMOS)工艺流程中使用。

著录项

  • 公开/公告号GB201513898D0

    专利类型

  • 公开/公告日2015-09-23

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号GB20150013898

  • 发明设计人

    申请日2013-03-29

  • 分类号H01L29/772;

  • 国家 GB

  • 入库时间 2022-08-21 14:53:44

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