首页>
外国专利>
Enhanced thermal management of 3-D stacked die packaging
Enhanced thermal management of 3-D stacked die packaging
展开▼
机译:增强了3D堆叠式芯片封装的热管理
展开▼
页面导航
摘要
著录项
相似文献
摘要
A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.
展开▼