ENCAPSULATION SHEET, ENCAPSULATION SHEET HAVING SEPARATOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an encapsulation sheet capable of appropriately embedding a semiconductor chip while preventing falling off from a suction collet at transportation, and an encapsulation sheet having a separator.SOLUTION: In an encapsulation sheet 40, a product α of thickness t[mm] and storage modulus G'[Pa] at 50°C satisfies the following equation 1. Equation 1: 300≤α≤1.5×105. In an encapsulation sheet having separator 10 including the encapsulation sheet 40 and a separator 41a, 41b laminated at least on one side of the encapsulation sheet 40, a product β of flexural modulus E[N/mm2] at 25°C and an area A[mm2] of the encapsulation sheet 40 satisfies the following equation 2. Equation 2: 4.0×106≤β≤1.7×109.SELECTED DRAWING: Figure 1