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Method of dip coating conductive substrate with post-treatment with aqueous sol-gel composition prior to dip coating curing

机译:在浸涂固化之前用水性溶胶-凝胶组合物进行后处理的浸涂导电基材的方法

摘要

The present invention is a method for at least partially coating a conductive substrate, at least (1) electrophoretically depositing an immersion varnish containing at least one binder onto the surface of the substrate. A step of at least partially coating the substrate with the immersion varnish, and (2) contacting the substrate at least partially coated with the immersion varnish with an aqueous composition, The aqueous composition used in (2) is an aqueous sol-gel composition, and the step (2) is performed before the electrophoretically deposited immersion varnish is cured; An at least partially coated substrate obtained by this method, and an immersion at least partially applied to the conductive substrate by at least partial electrophoretic deposition Aqueous sol for working up varnish layer - the use of a gel composition.
机译:本发明是一种用于至少部分涂覆导电基底的方法,至少(1)将包含至少一种粘合剂的浸渍清漆电泳沉积在基底的表面上。 (2)步骤中使用的水性组合物为水溶胶-凝胶组合物,该步骤至少部分地用浸没清漆涂覆基材,并且(2)使至少部分地用浸没清漆涂覆的基材接触。步骤(2)是在电泳沉积的浸入清漆固化之前进行的。通过这种方法获得的至少部分涂覆的基材,以及通过至少部分电泳沉积将至少部分浸入到导电基材上的用于加工清漆层的水性溶胶-使用凝胶组合物。

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