METHOD FOR DIP COATING ELECTRICALLY CONDUCTIVE SUBSTRATES WITH AFTER-TREATMENT OF THE DIP COATING WITH AN AQUEOUS SOL GEL COMPOSITION PRIOR TO ITS HARDENING

摘要

The present invention relates to a method for at least partly coating an electrically conductive substrate, comprising at least the steps of (1): at least partly coating the substrate with a dipping varnish comprising at least one binder, by at least partial electrophoretic deposition of the dipping varnish on the substrate surface, and (2): contacting the substrate at least partly coated with the dipping varnish with an aqueous composition, where the aqueous composition used in step (2) is an aqueous sol-gel composition and step (2) takes place before curing of the electrophoretically deposited dipping varnish, to an at least partly coated substrate obtainable by this method, and to the use of an aqueous sol-gel composition for aftertreating a dipping varnish layer applied at least partly to an electrically conductive substrate by an at least partial electrophoretic deposition.