METHOD FOR FORMING SOLDER BUMPS AND SOLDER PASTE FOR SOLDER BALL FIXING

摘要

PROBLEM TO BE SOLVED: To enable the temporary fixing of a solder ball more surely and reliably, and to form solder bumps with an increased yield and improved accuracy of height.SOLUTION: A method for forming solder bumps comprises the steps of: applying a solder paste 14 to each electrode 2 of a substrate 1; putting and temporarily fixing a solder ball 15 on the solder paste 14; and then, performing a reflow process on the solder paste 14 and the solder ball 15, thereby forming each solder bump 3. In the method, the solder paste includes solder powder and flux; the solder powder has an average particle diameter of 0.1-10 m; and the amount of the flux mixed is 75-93 vol.%.