METHOD FOR FORMING SOLDER BUMP AND SOLDER PASTE FOR FIXING SOLDER BALL

摘要

The method of forming the solder bump includes a step of applying a solder paste on the electrode of the substrate and temporarily fixing the solder ball on the solder paste and then reflowing the solder paste and the solder ball . The solder paste for fixing a solder ball contains a solder powder and a flux, wherein an average particle diameter of the solder powder is 0.1 to 10 , and a mixing amount of the flux is 75% by volume to 93% by volume.;