Pb-free Zn-Al alloy solder and the semiconductor element bonded clad material of Cu-based base

摘要

PROBLEM TO BE SOLVED: To provide a joint material having high joint strength, being excellent in a stress relaxation property, thermal conductivity and the like, and being a clad material whose base material is Cu and where a solder used between a semiconductor element and a substrate is cladded on both surfaces or one surface in a joint of the semiconductor element required for high reliability, such as a power device, and the substrate, and to provide a production method of the same.;SOLUTION: In a clad material constituted by a Pb-free Zn-Al-based alloy solder and a Cu-based base material, the composition of the Pb-free Zn-Al-based alloy solder is preferably expressed by that: the content of Al is 0.9 mass% or more and 9.0 mass% or less; one or more kinds among Ag, Cu, Ge, Mg, Sn and P may be contained; the content of Ag, Cu, Mg and Sn if contained is 2.0 mass% or less; the content of Ge if contained is 6.0 mass% or less; the content of P if contained is 0.5 mass% or less; and the balance is Zn except an element inevitably contained in production. In the clad material, a metal layer made of one or more kinds among Au, Ag, Ni and Cu is disposed on the surface of the Cu-based base material.;COPYRIGHT: (C)2015,JPO&INPIT