Bonded substrate processing method and processing apparatus

摘要

The present invention provides a method and a device for simultaneously processing an upper substrate and a lower substrate. The substrate processing method is to process a scribed groove because bonded substrates placed on a table (12) are irradiated with a laser beam. A laser source (20) emits the short pulse laser beam with 10 seconds or less of the pulse width to divide the laser beam into two laser beams. The two laser beams (L1, L2) penetrate a convex lens (37) for forming focal points at different divergent angles to form two different focal points (P', S'). The focal point (S') of one laser beam is positioned on an upper substrate (W1) among the bonded substrates (W), and the focal point (S') of the other laser beam is positioned on a lower substrate (W2) among the bonded substrates (W). Accordingly, the present invention can simultaneously process the upper substrate (W1) and the lower substrate (W2) using the focal point of the two laser beams.