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Cyanate ester resin prepreg, laminated board, cyanate ester resin-metal clad laminate, and led mounting board

机译:氰酸酯树脂预浸料,层压板,氰酸酯树脂-金属复合层压板和LED安装板

摘要

PROBLEM TO BE SOLVED: To provide a prepreg excellent in weatherability, heat resistance, dimensional stability and cost when used as an LED mounting substrate or a mounting substrate for electrical and electronic components or the like.SOLUTION: A cyanate ester resin prepreg comprises a glass cloth and a cyanate ester resin composition impregnated in the glass cloth. The cyanate ester resin composition contains (A) a cyanate ester compound containing one or more cyanate groups in a molecule, (B) a phenolic compound containing one or more phenolic hydroxyl groups in a molecule and (C) an inorganic filler contained in an amount of 1,000 pts.mass or less based on 100 pts.mass of the total of the component (A) and the component (B).
机译:解决的问题:当用作LED安装基板或用于电气和电子部件等的安装基板时,提供在耐候性,耐热性,尺寸稳定性和成本方面优异的预浸料。解决方案:氰酸酯树脂预浸料包括玻璃。玻璃布和浸渍在玻璃布中的氰酸酯树脂组合物。氰酸酯树脂组合物包含(A)在分子中含有一个或多个氰酸酯基的氰酸酯化合物,(B)在分子中含有一个或多个酚羟基的酚化合物和(C)一定量的无机填充剂。成分(A)和成分(B)的总和为100 pts.mass或少于1,000 pts.mass。

著录项

  • 公开/公告号JP6023677B2

    专利类型

  • 公开/公告日2016-11-09

    原文格式PDF

  • 申请/专利权人 信越化学工業株式会社;

    申请/专利号JP20130182781

  • 发明设计人 関口 晋;塩原 利夫;

    申请日2013-09-04

  • 分类号C08J5/24;H01L33/48;C08L79/00;C08K3/00;H01L23/14;

  • 国家 JP

  • 入库时间 2022-08-21 14:41:04

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