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Characteristic test method of a semiconductor device using a characteristic test device and apparatus for a semiconductor device

机译:使用特性测试装置的半导体器件的特性测试方法和用于半导体器件的设备

摘要

PROBLEM TO BE SOLVED: To provide a characteristic test device for semiconductor elements formed by sealing a semiconductor chip with resin, capable of reducing a test cost by simultaneously performing an insulation tolerance test of a resin seal part 15 with another characteristic test and reducing an occupation area of the entire characteristic test device, and to provide a method for testing characteristics of semiconductor elements using the device.;SOLUTION: A voltage application jig 1 for testing insulation resistance is brought into contact with the resin seal part 15 of a semiconductor element, and a high voltage that is applied in a static characteristic test or a dynamic characteristic test is applied to the voltage application jig 1 to simultaneously perform an insulation resistance test of the resin seal part 15 with a characteristic test (a leak current test, a voltage endurance characteristic test, an L loading test or the like).;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种用于通过用树脂密封半导体芯片而形成的半导体元件的特性测试装置,该特性测试装置能够通过与另一特性测试同时进行树脂密封部15的绝缘公差测试并减少占用,从而降低测试成本。解决方案:提供一种用于测试绝缘电阻的电压施加夹具1与半导体元件的树脂密封部分15接触,该装置用于测试使用该装置的半导体元件的特性。并且,对电压施加夹具1施加在静态特性测试或动态特性测试中施加的高电压,以同时进行树脂密封部15的绝缘电阻测试和特性测试(泄漏电流测试,电压测试)。耐力特性测试,L负载测试等);版权所有:(C)2013,日本特许厅&INPIT

著录项

  • 公开/公告号JP5817361B2

    专利类型

  • 公开/公告日2015-11-18

    原文格式PDF

  • 申请/专利权人 富士電機株式会社;

    申请/专利号JP20110195968

  • 发明设计人 山本 浩;

    申请日2011-09-08

  • 分类号G01R31/26;

  • 国家 JP

  • 入库时间 2022-08-21 14:40:50

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