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Reinforcing plate integrated flexible printed circuit board, and the reinforcing plate manufacturing method of an integrated flexible printed circuit board

机译:增强板集成柔性印刷电路板以及集成板柔性印刷电路板的增强板制造方法

摘要

Object of the present invention, the reinforcing plate integrated flexible printed circuit and the reinforcing plate integrated flexible printed circuit board are characterized in that they be attached to a reinforcing plate in the photosensitive resin composition on, defects such as swelling does not occur in the reflow mounting It is to provide a manufacturing method of a substrate. Reinforcing plate one made up in the order of (C) a photosensitive resin composition cured film (5), (4), (D) a flexible printed circuit board (1) (A) a reinforcing plate (6), (B) cement By adopting the configuration of the integrated flexible printed circuit board, it is possible to solve the above problems.
机译:本发明的目的是,增强板一体型挠性印刷电路板和增强板一体型挠性印刷电路板的特征在于,它们在感光性树脂组合物中附着在增强板上,在回流焊中不会发生溶胀等不良情况。安装提供一种基板的制造方法。增强板,按以下顺序排列:(C)感光树脂组合物固化膜(5),(4),(D)柔性印刷电路板(1)(A)增强板(6),(B)水泥通过采用集成柔性印刷电路板的配置,可以解决上述问题。

著录项

  • 公开/公告号JP5840131B2

    专利类型

  • 公开/公告日2016-01-06

    原文格式PDF

  • 申请/专利权人 株式会社カネカ;

    申请/专利号JP20120533900

  • 申请日2011-07-08

  • 分类号H05K1/02;H05K3/28;C08G59/42;C08F2/48;C08F2/44;C08L63/00;C08L75/04;C08L33/00;

  • 国家 JP

  • 入库时间 2022-08-21 14:39:37

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