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Conductive film for the material, the conductive film laminate, a manufacturing method of an electronic device, and a conductive film for the material and the conductive film laminates

机译:用于材料的导电膜,导电膜层压板,电子设备的制造方法以及用于材料和导电膜层压板的导电膜

摘要

is easy to crystallize by heat treatment, the sheet resistance value when the crystallization is low and to provide a conductive film for a material having an amorphous layer in which an increase in thickness is suppressed. Conductive film for the material has a transparent substrate, and an amorphous layer of indium tin oxide is laminated on the transparent substrate. The amorphous layer is made of indium tin oxide containing from 5.5 to 9 wt% of tin oxide in terms of a thickness of 15~25nm, and a sheet resistance value when crystallized 50~150 / is intended to be.
机译:容易通过热处理而结晶,结晶化低时的薄层电阻值,并且提供用于具有抑制了厚度增加的非晶层的材料的导电膜。用于该材料的导电膜具有透明基板,并且在透明基板上层叠有氧化铟锡的非晶层。非晶层由氧化铟锡制成,该氧化铟锡的厚度为15〜25nm,并且包含5.5〜9wt%的氧化锡,并且预期结晶时的薄层电阻值为50〜150μm。

著录项

  • 公开/公告号JPWO2013172354A1

    专利类型

  • 公开/公告日2016-01-12

    原文格式PDF

  • 申请/专利权人 旭硝子株式会社;

    申请/专利号JP20140515643

  • 发明设计人 富田 倫央;小林 健太;

    申请日2013-05-14

  • 分类号H01B5/14;H01B13;C23C14/08;C23C14/34;B32B9;G06F3/041;

  • 国家 JP

  • 入库时间 2022-08-21 14:39:29

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