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BASE FILM FOR DICING SHEET, DICING SHEET COMPRISING BASE FILM, AND METHOD OF MANUFACTURING BASE FILM

机译:用于切割片的基底膜,包括基底膜的切割片以及制造基底膜的方法

摘要

A base film (2) of a dicing sheet includes a cutting-fragment suppression layer (A) and an expandable layer (B) laminated on one main surface of the cutting-fragment suppression layer (A). The expandable layer (B) has a laminate structure of a plurality of resin-based sublayer, including a resin-based sublayer (B1) located nearest to the cutting-fragment suppression layer (A) and a resin-based sublayer (B2) that is at least one of other resin-based sublayers than the resin-based sublayer (B1). The resin-based sublayer (B1) comprises a linear polyethylene as a primary resin. The resin-based sublayer (B2) comprises an ethylene-(meth)acrylic acid series copolymer as a primary resin. The cutting-fragment suppression layer (A) comprises a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).
机译:切割片的基膜( 2 )包括切割碎片抑制层(A)和层压在切割碎片抑制层(A)的一个主表面上的可膨胀层(B)。可膨胀层(B)具有多个树脂基层的叠层结构,包括最靠近切割碎片抑制层(A)的树脂基层(B 1 )和树脂层。树脂基层(B 2 )是除树脂基层(B 1 )之外的其他树脂基层中的至少一个。树脂基子层(B 1 )包含线性聚乙烯作为主要树脂。树脂基层(B 2 )包含乙烯-(甲基)丙烯酸系列共聚物作为主要树脂。切割碎片抑制层(A)包括含环树脂(a 1 ),该含环树脂是具有芳族系列基环和脂族系列基环中的至少一种的热塑性树脂。非环状烯烃系树脂(a 2 )是除含环树脂(a 1 )以外的烯烃系热塑性树脂。

著录项

  • 公开/公告号US2016297179A1

    专利类型

  • 公开/公告日2016-10-13

    原文格式PDF

  • 申请/专利权人 LINTEC CORPORATION;

    申请/专利号US201415037536

  • 申请日2014-11-07

  • 分类号B32B27/08;B32B27/30;B32B27/32;C09J7/02;

  • 国家 US

  • 入库时间 2022-08-21 14:39:24

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