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BASE FILM FOR DICING SHEET, DICING SHEET COMPRISING BASE FILM, AND METHOD OF MANUFACTURING BASE FILM
BASE FILM FOR DICING SHEET, DICING SHEET COMPRISING BASE FILM, AND METHOD OF MANUFACTURING BASE FILM
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机译:用于切割片的基底膜,包括基底膜的切割片以及制造基底膜的方法
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摘要
A base film (2) of a dicing sheet includes a cutting-fragment suppression layer (A) and an expandable layer (B) laminated on one main surface of the cutting-fragment suppression layer (A). The expandable layer (B) has a laminate structure of a plurality of resin-based sublayer, including a resin-based sublayer (B1) located nearest to the cutting-fragment suppression layer (A) and a resin-based sublayer (B2) that is at least one of other resin-based sublayers than the resin-based sublayer (B1). The resin-based sublayer (B1) comprises a linear polyethylene as a primary resin. The resin-based sublayer (B2) comprises an ethylene-(meth)acrylic acid series copolymer as a primary resin. The cutting-fragment suppression layer (A) comprises a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).
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