首页> 外国专利> BASE FILM FOR DICING SHEET, DICING SHEET COMPRESING BASE FILM, AND METHOD OF MANUFACTURING BASE FILM

BASE FILM FOR DICING SHEET, DICING SHEET COMPRESING BASE FILM, AND METHOD OF MANUFACTURING BASE FILM

机译:切割片的基片,切割片的压缩基片和制造基片的方法

摘要

Base film for a dicing sheet comprises a cutting-fragment suppression layer and an expandable layer laminated on one main surface of the cutting-fragment suppression layer. The expandable layer comprises at least one resin-based unit layer. The at least one resin-based unit layer includes a resin-based unit layer that is disposed nearest to the cutting-fragment suppression layer. The resin-based unit layer comprises a linear polyethylene, polypropylene, and thermoplastic elastomer. The cutting-fragment suppression layer comprises a ring-containing resin that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin that is an olefin-based thermoplastic resin other than the ring-containing resin. The base film for such a dicing sheet is excellent in the expandability and recoverability.
机译:切割片用基膜包括切割碎片抑制层和层压在切割碎片抑制层的一个主表面上的可膨胀层。可膨胀层包括至少一个基于树脂的单元层。至少一个基于树脂的单元层包括最靠近切割碎片抑制层布置的基于树脂的单元层。树脂基单元层包含线性聚乙烯,聚丙烯和热塑性弹性体。切割碎片抑制层包括含环树脂和无环烯烃类树脂,所述含环树脂是具有至少一种类型的芳族系列环和脂族系列的环的热塑性树脂和无环烯烃类树脂,其是烯烃类热塑性塑料。含环树脂以外的树脂。这种切割片的基膜的膨胀性和恢复性优异。

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