首页> 外国专利> FORMATION OF A I-III-VI2 SEMICONDUCTOR LAYER BY HEAT TREATMENT AND CHALCOGENIZATION OF AN I-III METALLIC PRECURSOR

FORMATION OF A I-III-VI2 SEMICONDUCTOR LAYER BY HEAT TREATMENT AND CHALCOGENIZATION OF AN I-III METALLIC PRECURSOR

机译:通过热处理和I-III金属前驱物的碳化处理形成I-III-VI2半导体层

摘要

A process for forming a semiconductor layer, especially with a view to photovoltaic applications, and more particularly to a process for forming a semiconductor layer of I-III-VI2 type by heat treatment and chalcogenization of a metallic precursor of I-III type, the process comprising: a heating step under an inert atmosphere during which the temperature increases uniformly up to a first temperature of between 460° C. and 540° C., in order to enable the densification of the metallic precursor, and a chalcogenization step beginning at said first temperature and during which the temperature continues to increase up to a second temperature, a stabilization temperature, of between 550° C. and 600° C., in order to enable the formation of the semiconductor layer. The formation of a semiconductor layer, or equivalently of an absorber, having a gain in conversion efficiency of around 4%, is thus advantageously achieved.
机译:形成半导体层的方法,特别是考虑到光伏应用,尤其涉及通过金属的热处理和硫属元素形成I-III-VI 2 型半导体层的方法I-III型前体,该方法包括:在惰性气氛下的加热步骤,在该步骤中温度均匀地升高至460℃至540℃之间的第一温度,以使金属致密化前驱体,以及硫族化步骤,从所述第一温度开始,在此期间温度继续升高到第二温度,即介于550℃和600℃之间的稳定温度,以便能够形成半导体层。因此,有利地实现了具有大约4%的转换效率增益的半导体层或等效地吸收体的形成。

著录项

  • 公开/公告号US2016079454A1

    专利类型

  • 公开/公告日2016-03-17

    原文格式PDF

  • 申请/专利权人 NEXCIS;

    申请/专利号US201414888786

  • 发明设计人 CEDRIC BROUSSILLOU;SYLVIE BODNAR;

    申请日2014-04-30

  • 分类号H01L31/032;H01L21/677;F27D7/06;H01L31/036;F27B9/10;H01L31/18;H01L21/67;

  • 国家 US

  • 入库时间 2022-08-21 14:36:37

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