首页>
外国专利>
Low void solder joint for multiple reflow applications
Low void solder joint for multiple reflow applications
展开▼
机译:低空隙焊点,适用于多种回流应用
展开▼
页面导航
摘要
著录项
相似文献
摘要
Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.
展开▼