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Effect of Solder Voids and Distance to Neutral Point (DNP) on SJR of WCSP Under Reflow Condition and Thermal Cycling

机译：回流条件和热循环条件下焊锡空隙和中性点距离对WCSP SJR的影响

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作者
Doiphode, Aniruddha.;
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作者单位

The University of Texas at Arlington.;

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授予单位 The University of Texas at Arlington.;
学科 Mechanical engineering.;Materials science.
学位 M.S.M.E.
年度 2017
页码 49 p.
总页数 49
原文格式 PDF
正文语种 eng
中图分类
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6. Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints [O] . Jiajie Fan, Jie Wu, Changzhen Jiang, 2020

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Effect of Solder Voids and Distance to Neutral Point (DNP) on SJR of WCSP Under Reflow Condition and Thermal Cycling

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