Method for manufacturing product involving solder joining, solder joining apparatus, soldering condition verification method, reflow apparatus, and solder joining method
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机译:涉及焊料接合的产品的制造方法,焊料接合装置,焊接条件确认方法,回流焊装置以及焊料接合方法
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摘要
A method for manufacturing a product involving solder joining wherein components placed on a board on which the components are to be mounted are solder-joined to the board by subjecting the board to reflow heating under prescribed heating conditions, the method comprising: calculating, at each designated site on the board, a component volume that is occupied by the components mounted within a given area; determining the heating conditions in accordance with the calculated component volume; and performing the reflow heating based on the determined heating conditions.
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