首页>
外国专利>
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package
展开▼
机译:倒装芯片封装中的半导体器件和在芯片与衬底之间形成冶金互连的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on a bump side thereof and a substrate having a set of interconnect points on a metallization thereon, providing a measured quantity of a polymer adhesive in a middle region of the chip on the bump side, aligning the chip with the substrate so that the set of bumps aligns with the set of interconnect points, pressing the chip and the substrate toward one another so that a portion of the polymer adhesive contacts the substrate and the bumps contact the interconnect points, and heating the bumps to a temperature sufficiently high to form a metallurgical connection between the bumps and the interconnect points.
展开▼