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Temperature compensation in a semiconductor micromechanical resonator via charge carrier depletion

机译:半导体微机械谐振器中通过载流子耗尽进行温度补偿

摘要

A semiconductor resonator has a substrate with a thickness extending between a first end and a second end and a pn-junction along the thickness of the substrate forming a free charge carrier depletion region. In another embodiment, a semiconductor resonator has a substrate with a crystal lattice doped at degenerate levels such that the flow of free charge carriers can be minimized. A method of compensating a temperature coefficient of a semiconductor resonator by creating a pn-junction based free charge carrier depletion region within a thickness of a substrate of the resonator is also disclosed.
机译:半导体谐振器具有衬底,该衬底的厚度在第一端和第二端之间延伸,并且pn结沿着该衬底的厚度形成自由电荷载流子耗尽区。在另一个实施例中,半导体谐振器具有衬底,该衬底具有以简并水平掺杂的晶格,从而可以使自由电荷载流子的流动最小化。还公开了一种通过在谐振器的衬底的厚度内创建基于pn结的自由电荷载流子耗尽区来补偿半导体谐振器的温度系数的方法。

著录项

  • 公开/公告号US9319020B2

    专利类型

  • 公开/公告日2016-04-19

    原文格式PDF

  • 申请/专利权人 FARROKH AYAZI;ASHWIN SAMARAO;

    申请/专利号US201113276931

  • 发明设计人 ASHWIN SAMARAO;FARROKH AYAZI;

    申请日2011-10-19

  • 分类号H03H9/24;H03H3/013;H03H3/007;H03H9/02;B81B3/00;

  • 国家 US

  • 入库时间 2022-08-21 14:31:28

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